Computing Now's News Podcast
IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips
- Autor: Vários
- Narrador: Vários
- Editora: Podcast
- Duração: 0:03:19
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Sinopse
IBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors.
